基于TSV硅转接板封装结构的力学可靠性分析

导航

杨静，王波，刘勇

Mechanical Reliability Analysis of the Packaging Architecture with TSV Interposer

YANG Jing, WANG Bo, LIU Yong

电子与封装 . 2019, (10): 4 -7 . DOI: 10.16257/j.cnki.1681-1070.2019.1002