基于Icepak的小外形封装结构热设计和分析*

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胡文华，徐　成，徐　健，孙　鹏

Thermal Design and Analysis of Small Outline Package Structure Based on Icepak

HU Wenhua, XU Cheng, XU Jian, SUN Peng

电子与封装 . 2018, (11): 1 -4 . DOI: 10.16257/j.cnki.1681-1070.2018.0117