军用倒装焊器件底部填充胶选型及验证方法讨论
冯春苗, 张欲欣, 付博彬
Discussion on Type Selection and Verification Method of Underfill Adhesive for Military Flip Chip Solder Devices
FENG Chunmiao, ZHANG Yuxin, FU Bobin
电子与封装
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2020, (5): 50201
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DOI: 10.16257/j.cnki.1681-1070.2020.0502
