陶瓷封装电路键合引线冲击应力下的短接判定方法

导航

季振凯，徐彦峰，卢礼兵

Method of Short-Circuit Determination of Bonded Wire under Shocked Stress in Ceramic Package Circuit

JI Zhenkai,XU Yanfeng,LU Libing

电子与封装 . 2017, (5): 8 -11 . DOI: 10.16257/j.cnki.1681-1070.2017.0055