导电胶粘接片式器件侧边胶量仿真优化与验证

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李文,李阳阳,朱晨俊,赵鸣霄

Optimization on H20E Bonding Surface Mount Device via Simulation and Experiments

LI Wen, LI Yangyang, ZHU Chenjun, ZHAO Minxiao

电子与封装 . 2020, (6): 60402 - . DOI: 10.16257/j.cnki.1681-1070.2020.0607