夹层式叠层芯片引线键合技术及其可靠性

导航

常乾，朱媛，曹玉媛，丁荣峥

Research on Wire Bonding Technology and Reliability for Ceramic-Packaged Sandwiched Multi-Stack Die

CHANG Qian,ZHU Yuan,CAO Yuyuan,DING Rongzheng

电子与封装 . 2017, (2): 4 -8 . DOI: 10.16257/j.cnki.1681-1070.2017.0014