常用树脂对IC封装用环氧塑封料性能影响

导航

郭利静，张力红，武红娟，代瑞慧

Study on the Effect of Resin Selection on Epoxy Moulding Compound in IC Packaging Industry

GUO Lijing , ZHANG Lihong, WU Hongjuan , DAI Ruihui

电子与封装 . 2019, (9): 19 -23 . DOI: 10.16257/j.cnki.1681-1070.2019.0905