中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

导航
PTFE基微波覆铜板中FEP含量对孔隙率的影响
陈强,张勇,张军然,徐永兵
Effect of FEP Content on Porosity in PTFE-based Microwave Copper Clad Laminate
CHEN Qiang, ZHANG Yong, ZHANG Junran, XU Yongbing
电子与封装 . 2019, (9): 32 -33 .  DOI: 10.16257/j.cnki.1681-1070.2019.0908