多芯片陶瓷封装的结-壳热阻分析方法

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高　辉, 仝良玉, 蒋长顺

Studies on Analysis Method of Junction-to-Case Thermal Resistance of Ceramic Multi-chip Packaging

GAO Hui, TONG Liangyu, JIANG Changshun

电子与封装 . 2016, (7): 1 -4 . DOI: 10.16257/j.cnki.1681-1070.2016.0076