OSP工艺改性铜粉/环氧树脂导电胶的研制<sup>*</sup>

导航

郭丹;胡明荣;李良超

Preparation and Performance of OSP ProcessModified Copper Powder/Epoxy Electrically Conductive Adhesive

GUO Dan, HU Mingrong, LI Liangchao

电子与封装 . 2020, (9): 90204 - . DOI: 10.16257/j.cnki.1681-1070.2020.0912