中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

导航
真空回流焊接搪锡去金工艺研究
张建;金家富;张丽;李安成;汪秉庆
Research of Tin-coating and De-golding Processfor Vacuum Reflow Soldering Technology
ZHANG Jian, JIN Jiafu, ZHANG Li, LI Ancheng, WANG Bingqing
电子与封装 . 2020, (9): 90405 - .  DOI: 10.16257/j.cnki.1681-1070.2020. 0913