三维集成电路稳态解和瞬态解的建模与热分析<sup>*</sup>

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陈品忠,潘中良

Modelingand Thermal Analysis of Steady and Transient Solutions for 3-DimensionalIntegrated Circuits

CHEN Pinzhong, PAN Zhongliang

电子与封装 . 2021, (1): 10205 - . DOI: 10.16257/j.cnki.1681-1070.2021.0108