倒装焊后清洗工艺及其对底部填充的影响

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汤姝莉,赵国良,张健,薛亚慧

Investigationon Cleaning Technology after Flip Chip Bonding and its Influence on Underfill

TANG Shuli, ZHAO Guoliang, ZHANG Jian, XUE Yahui

电子与封装 . 2021, (2): 20201 - . DOI: 10.16257/j.cnki.1681-1070.2021.0202