高密度封装中互连结构差分串扰建模与分析
宣慧,于政,吴华,丁万春,高国华
Modeling andAnalysis of Differential Crosstalk of Interconnect Structure inHigh Density Packaging
XUAN Hui, YU Zheng, WU Hua, DING Wanchun, GAO Guohua
电子与封装
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2021, (2): 20203
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DOI: 10.16257/j.cnki.1681-1070.2021.0207
