陶瓷柱栅阵列封装电路器件级热学环境可靠性评估
李菁萱;谢晓辰;王胜杰;林鹏荣;王勇
Influence of ThermalEnvironment on the Reliability of Ceramic Column Grid Array Package
LI Jingxuan, XIE Xiaochen, WANG Shengjie, LIN Pengrong, WANG Yong
电子与封装
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2021, (5): 50201
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DOI: 10.16257/j.cnki.1681-1070.2021.0502
