基于有限元分析和机器学习的跌落所致封装结构力学行为预测
张筱迪,毛明晖,卢昶衡,王文武,贾冯睿,龙旭
Prediction ofMechanical Behavior of Package Structure Subjected to Drop Impact Based onFinite Element Analysis and Machine Learning
ZHANG Xiaodi, MAO Minghui, LU Changheng, WANG Wenwu, JIA Fengrui, LONG Xu
电子与封装
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2021, (2): 20204
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DOI: 10.16257/j.cnki.1681-1070.2021.0201
