一种基于扇出晶圆级封装技术的控制模块设计
刘骁知;曾小平;冉万宁;丁杰;周佳明
Design of a Controller Module Based onFan-Out Wafer Level Packaging Technology
LIU Xiaozhi, ZENG Xiaoping, RAN Wanning, DING Jie, ZHOU Jiaming
电子与封装
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2021, (8): 80202
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DOI: 10.16257/j.cnki.1681-1070.2021.0806
