键合过程中金属间化合物形成区域的分布研究
刘美;王志杰;孙志美;牛继勇;徐艳博
Study on the Distribution of IntermetallicCompound Formation Region During Wire Bonding
LIU Mei, WANG ZhiJie, SUN ZhiMei, NIU JiYong, XU Yanbo
电子与封装
.
2021, (8): 80205
-
.
DOI: 10.16257/j.cnki.1681-1070.2021.0808
