集成电路检验/失效分析过程芯片去层制备方法
汪小青;虞勇坚;马勇;刘晓晔;吕栋
Discussion on Chip De-layeringMethod in the Process of Integration Circuit Inspection and Analysis
WANG Xiaoqing, YU Yongjian, MA Yong, LIU Xiaoye, LYU Dong
电子与封装
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2021, (8): 80404
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DOI: 10.16257/j.cnki.1681-1070.2021.0813
