中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

导航
有机包覆抗硫化腐蚀的银键合丝研究
徐豪杰;叶志镇;潘新花;薛子夜;赵义东;谢海涛
Study of anOrganic-Coated Silver Bonding Wire with Anti-Sulfuration Corrosion
XU Haojie, YE Zhizhen, PAN Xinhua, XUE Ziye, ZHAO Yidong, XIE Haitao
电子与封装 . 2021, (8): 80206 - .  DOI: 10.16257/j.cnki.1681-1070.2021.0814