基于电容补偿的键合金丝互连微波特性研究

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王磊;王爱华

Research on the MicrowaveCharacteristic of Bonding Wire Based on Capacitance Compensation

WANG Lei, WANG Aihua

电子与封装 . 2021, (9): 90207 - . DOI: 10.16257/j.cnki.1681-1070.2021.0913