不同厚度GaAs通孔技术研究

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闫未霞, 彭挺, 郭盼盼, 强欢, 莫中友, 孔欣

Research of the Backside Via-Hole forDifferent Thickness GaAs

YAN Weixia, PENG Ting, GUO Panpan, QIANG Huan, MO Zhongyou, KONG Xin

电子与封装 . 2021, (11): 110401 - . DOI: 10.16257/j.cnki.1681-1070.2021.1106