车用塑封集成电路封装失效率估计

doi:10.16257/j.cnki.1681-1070.2021.0901

电子与封装 ›› 2021, Vol. 21 ›› Issue (9): 090101 . doi: 10.16257/j.cnki.1681-1070.2021.0901

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车用塑封集成电路封装失效率估计

吴世芳¹;潘进豊¹;谢杰任²

1. 蔚思博检测技术合肥有限公司车电功能安全服务事业处，上海　201203；2. 虎尾科技大学，台湾云林 63230

收稿日期:2020-11-16 发布日期:2021-03-29
作者简介:吴世芳（1964—），男，台湾云林人，1989年成功大学矿冶及材料硕士，曾在Foundry及IC设计公司RD部门服务近30年，目前任职蔚思博检测（合肥）公司车电功能安全服务事业处总监，主要专长和研究方向为集成电路、车用电子功能安全架构设计、可靠度工程与发展、FMEA等。

Package Failure Ratefor the Automotive Plastic Package IC

WU Ted¹, PAN Peter¹, SHIE Jieren²

1. FunctionalSafety Service Division, VESP Technology Co. Ltd., Shanghai 201203,China; 2. National Formosa University, Yunlin, Taiwan 63230, China

Received:2020-11-16 Published:2021-03-29

摘要/Abstract

摘要： 可靠度预估计的方法众多，就IEC 62380的车用塑封集成电路封装失效率估计数学模型进行了探讨及拓展。提出车用供应链任务轮廓信息交换的方式和内容以确保可靠性与稳健性，并根据其数学模型发展了一套封装失效率估算流程和合理化方法，以帮助开发者更方便地应用规范，并使封装失效率预估更贴近真实状况。

关键词: 可靠度预估, 封装失效率预估, IEC62380, 任务轮廓

Abstract: There are many methods for predicting reliability. This research discusses and develops further only on the IEC 62380 about the mathematical estimation model of package failure rate for the automotive plastic package IC. In addition to the IEC 62380 model, this research provides the way and content of mission profiles exchanged along the entire supply chain to ensure robustness and reliability, as well as the development of a rational method and process to estimate the package failure rate based on the IEC 62380 mathematical model. The purposes have two, one to help developers to apply IEC 62380 easier, and the other to help to estimate the package failure rate closer to the real condition.

Key words: reliabilityprediction, packagefailurerateestimation, IEC62380, missionprofile

中图分类号:

TN305.94

吴世芳;潘进豊;谢杰任. 车用塑封集成电路封装失效率估计[J]. 电子与封装, 2021, 21(9): 090101 .

WU Ted, PAN Peter, SHIE Jieren. Package Failure Ratefor the Automotive Plastic Package IC[J]. Electronics & Packaging, 2021, 21(9): 090101 .

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中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

车用塑封集成电路封装失效率估计

Package Failure Ratefor the Automotive Plastic Package IC

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