中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2024, Vol. 24 ›› Issue (4): 040203 . doi: 10.16257/j.cnki.1681-1070.2024.0018

• 封装、组装与测试 • 上一篇    下一篇

微电路模块异质黏接封装失效行为的研究

黄国平,王晓卫,陈科科   

  1. 深圳市振华微电子有限公司,广东 深圳?518057
  • 收稿日期:2023-09-08 出版日期:2024-04-24 发布日期:2024-04-24
  • 作者简介:黄国平(1985—),男,福建三明人,硕士,高级工程师,主要研究方向为电子材料与电力电子模块微组装。

Research on the Failure Behavior of Heterogeneous Bonding Packaging in Microcircuit Modules

HUANG Guoping, WANG Xiaowei, CHEN Keke   

  1. Shenzhen Zhenhua MicroelectronicsCo., Ltd., Shenzhen 518057, China
  • Received:2023-09-08 Online:2024-04-24 Published:2024-04-24

摘要: 为了避免微电路模块的异质黏接封装失效,采用铝合金表面处理和塑料外壳改性的方法,实现优良的异质黏接封装效果。在金属与塑料的异质黏接封装过程中,采用经过150目喷砂预处理的6061铝合金底板,将聚苯硫醚(PPS)塑料外壳从底板上剥离,剥离强度最大可达1.83 N/mm,异质黏接封装的可靠性得到明显提高,开裂失效得到有效抑制。在PPS塑料外壳中添加质量分数为30%的玻璃纤维,在125 ℃下对其进行2 h的退火热处理,其抗弯强度最大可达246 MPa,该工艺有效改善了由于PPS塑料外壳侧壁鼓包变形导致的封装失效。

关键词: 微电路模块, 异质黏接封装, 开裂, 鼓包

Abstract: In order to avoid the failure of heterogeneous bonding packaging in microcircuit modules, methods of aluminum alloy surface treatment and plastic shell modification are used to achieve excellent heterogeneous bonding packaging effects. In the process of heterogeneous bonding packaging of metal and plastic, a 150 mesh sandblasted pre-treated 6061 aluminum alloy substrate is used, and the polyphenylene sulphide (PPS) plastic shell is peeled off from the substrate, with a maximum peeling strength of 1.83 N/mm. The reliability of the heterogeneous bonding packaging is significantly improved, and the failure of cracking is effectively suppressed. Adding glass fiber with a mass fraction of 30% to the PPS plastic shell, and annealing it at 125 ℃ for 2 h, the maximum flexural strength can reach 246 MPa, which effectively improves the packaging failure due to the bulging deformation of the side wall of the PPS plastic shell.

Key words: microcircuit module, heterogeneous bonding packaging, cracking, bulge

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