关键词: 微电路模块, 异质黏接封装, 开裂, 鼓包

Abstract: In order to avoid the failure of heterogeneous bonding packaging in microcircuit modules, methods of aluminum alloy surface treatment and plastic shell modification are used to achieve excellent heterogeneous bonding packaging effects. In the process of heterogeneous bonding packaging of metal and plastic, a 150 mesh sandblasted pre-treated 6061 aluminum alloy substrate is used, and the polyphenylene sulphide (PPS) plastic shell is peeled off from the substrate, with a maximum peeling strength of 1.83 N/mm. The reliability of the heterogeneous bonding packaging is significantly improved, and the failure of cracking is effectively suppressed. Adding glass fiber with a mass fraction of 30% to the PPS plastic shell, and annealing it at 125 ℃ for 2 h, the maximum flexural strength can reach 246 MPa, which effectively improves the packaging failure due to the bulging deformation of the side wall of the PPS plastic shell.

Key words: microcircuit module, heterogeneous bonding packaging, cracking, bulge