关键词: 裸芯片, 首次选用, 应用可靠性, 评价

Abstract: Restricted by size and weight of the equipment, under equipment demand of multi-function, high precision and high reliability, the equipment begins to use bare chips instead of packaged devices. The direct application of bare chips without packaging has brought partly cost reduction, but the bare chips without packaging protection have put forward higher requirements for quality and reliability. At the time of the first selection, based on the risk analysis of the reliability of the bare chip application, the reliability evaluation project is designed, the evaluation program is completed, the function/performance, reliability and adaptability of the bare chips are evaluated and mapped. Practical results show that the application reliability evaluation method based on risk analysis can effectively avoid the device application with quality risk or reliability not meeting the requirements.

Key words: bare chip, first selection, application reliability, evaluation