中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2024, Vol. 24 ›› Issue (5): 050205 . doi: 10.16257/j.cnki.1681-1070.2024.0063

• 封装、组装与测试 • 上一篇    下一篇

基于TEC和平板热管的LED散热器结构优化设计*

高杰,樊凤昕,马丹竹,建伟伟,李壮   

  1. 辽宁石油化工大学石油天然气工程学院,辽宁 抚顺 ?113001
  • 收稿日期:2023-11-06 出版日期:2024-05-27 发布日期:2024-05-27
  • 作者简介:高杰(1997—),男,河北张家口人,硕士研究生,主要从事LED散热器结构优化的研究;

Optimized Design of LED Radiator Structure Based on TEC and Flat-Plate Heat Pipe

GAO Jie, FAN Fengxin, MA Danzhu, JIAN Weiwei, LI Zhuang   

  1. Collegeof Petroleum Engineering, Liaoning Petrochemical University, Fushun113001, China
  • Received:2023-11-06 Online:2024-05-27 Published:2024-05-27

摘要: LED结温对其寿命和光效具有显著影响。高效的热管理对保持LED的性能稳定非常重要。为了有效降低LED结温、满足散热需求及特定场所的应用需求,结合热电冷却器(TEC)和平板热管(FPHP)重新设计了散热器结构,利用响应面法构建了针对散热器参数的双目标函数,通过非支配排序遗传算法(NSGA-II)求得Pareto最优解。基于散热器结构的最优值对TEC电流进行单因素优化分析,结果表明,优化后的LED最高结温比不采用TEC时的LED最高结温降低了23.3%,充分证明了优化散热器结构的有效性。

关键词: 封装技术, LED, 散热器, 热电冷却器, 平板热管

Abstract: Junction temperature of LED has a significant impact on its lifetime and luminous efficacy. Efficient thermal management is important to maintain stable LED performance. In order to effectively reduce the LED junction temperature and meet the heat dissipation requirements and the application requirements of specific places, the heat sink structure is redesigned by combining the thermoelectric cooler (TEC) and the flat-plate heat pipe (FPHP), and the bi-objective function for the parameters of the radiator is constructed by using the response surface method, and the optimal solution of Pareto is obtained by the non-dominated sorting genetic algorithm (NSGA-II). One-factor optimization analysis of TEC current is performed based on the optimum value of the radiator structure. The results show that the maximum junction temperature of the optimized LED is 23.3% lower than the maximum junction temperature of the LED without TEC, which fully demonstrates the effectiveness of the optimized radiator structure.

Key words: packaging technology, LED, radiator, thermoelectric cooler, flat-plate heat pipe

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