面向Chiplet集成的三维互连硅桥技术*

doi:10.16257/j.cnki.1681-1070.2024.0102

摘要/Abstract

摘要： 摩尔定律的发展速度放缓和集成电路产品应用的多元化趋势，共同推动了先进封装技术的快速发展。先进互连技术是先进封装的核心，在高速、高频传输、功耗、超细节距互连以及系统集成能力等方面均展现出显著优势。硅桥技术作为Chiplet以及异构集成封装的重要解决方案，可以以较低的成本实现多芯片间的局部高密度互连，在处理器、存储器、射频器件中被广泛应用。介绍了业界主流的硅桥技术，并对硅桥技术的结构特点和关键技术进行了分析和总结。深入讨论了硅桥技术的发展趋势及挑战，为相关领域的进一步发展提供参考。

关键词: 先进互连技术, Chiplet, 硅桥技术, 高密度互连

Abstract: Slowdown of Moore's Law and the trend towards diversification in IC product applications have combined to drive the rapid development of advanced packaging technology. Advanced interconnect technology is the core of advanced packaging, and it shows significant advantages in high-speed, high-frequency transmission, power consumption, ultra-fine pinch interconnect as well as the ability of system integration capability. As an important solution for Chiplet and heterogeneous integrated packaging, silicon bridge technology can achieve local high-density interconnections among multiple chips at low cost, and it is widely used in processors, memories, and radio frequency devices. The mainstream silicon bridge technologies in the industry are introduced, and the structural features and key technologies of silicon bridge technology are analyzed and summarized. Meanwhile, the development trends and challenges of silicon bridge technology are discussed in depth to provide reference for further development in related fields.

Key words: advanced interconnect technology, Chiplet, silicon bridge technology, high-density interconnection

中图分类号:

TN305.94

赵瑾,于大全,秦飞. 面向Chiplet集成的三维互连硅桥技术^*[J]. 电子与封装, 2024, 24(6): 060101 .

ZHAO Jin, YU Daquan, QIN Fei. 3D Interconnect Silicon Bridge Technology for Chiplet Integration[J]. Electronics & Packaging, 2024, 24(6): 060101 .

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中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

面向Chiplet集成的三维互连硅桥技术^*

3D Interconnect Silicon Bridge Technology for Chiplet Integration

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