硅转接板制造与集成技术综述

doi:10.16257/j.cnki.1681-1070.2024.0119

摘要/Abstract

摘要： 集成电路制程发展放缓，具有高密度、高集成度以及高速互连优势的先进封装技术成为提升芯片性能的关键。硅转接板可实现三维方向的最短互连以及芯片间的高速互连，是高算力和人工智能应用的主流封装技术。从硅转接板设计、制造以及2.5D/3D集成等方面，系统阐述了硅转接板技术的发展现状和技术难点，并对相关关键工艺技术进行详细介绍。

关键词: 先进封装, 硅转接板, 硅通孔, 三维集成

Abstract: As the development of integrated circuit process slows down, advanced packaging technology with high density, high integration and high-speed interconnection has become the key to improve chip performance. Silicon interposer provides the shortest interconnection in three-dimensional direction and the high-speed interconnection between chips, and it is the mainstream packaging technology for high performance computing and artificial intelligence applications. The development status and technical difficulties of silicon interposer technology are systematically described from the silicon interposer design, manufacturing and 2.5D /3D integration, and the related key process technologies are introduced in detail.

Key words: advanced packaging, silicon interposer, through silicon via, three-dimension integration

中图分类号:

TN305.94

徐成,樊嘉祺,张宏伟,王华,陈天放,刘丰满. 硅转接板制造与集成技术综述[J]. 电子与封装, 2024, 24(6): 060106 .

XU Cheng, FAN Jiaqi, ZHANG Hongwei, WANG Hua, CHEN Tianfang, LIU Fengman. Review of Silicon Interposer Fabrication and Integration Technology[J]. Electronics & Packaging, 2024, 24(6): 060106 .

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中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊