集成电路异构集成封装技术进展

doi:10.16257/j.cnki.1681-1070.2024.0125

摘要/Abstract

摘要： 随着集成电路临界尺寸不断微缩，摩尔定律的持续性受到了越来越大的挑战，这使得不同类型芯片的异构集成技术成为后摩尔时代至关重要的技术趋势。先进封装技术正在经历一场转型，其关注点逐渐从单一器件转向整体系统性能和成本。传统的芯片封装正朝着三维堆叠、多功能集成和混合异构集成的方向发展，以实现集成产品的高度集成、低功耗、微型化和高可靠性等优势。概述了芯片异构集成封装技术的发展轨迹和研究现状，并探讨了面临的技术挑战以及未来的发展趋势。

关键词: 先进封装, 异构集成, 芯粒封装, 三维集成, 混合键合

Abstract: With the ongoing reduction in critical sizes of integration circuit, the sustainability of Moore's Law faces increasing challenges, which makes the heterogeneous integration technology of different types of chips become a crucial technical trend in the post-Moore era. Advanced packaging technology is undergoing a transformation, with the focus gradually shifting from individual devices to overall system performance and manufacturing cost. Traditional chip packaging is developing towards three-dimensional stacking, multi-function integration and hybrid heterogeneous integration to achieve the advantages of high integration, low power consumption, miniaturization and high reliability of integrated products. The development track and research status of chip heterogeneous integrated packaging technology are summarized, and the technical challenges and future development trends are discussed.

Key words: advanced packaging, heterogeneous integration, Chiplet packaging, three-dimensional packaging, hybrid bonding

中图分类号:

TN305.94

陈祎;岳琨;吕复强;姚大平. 集成电路异构集成封装技术进展[J]. 电子与封装, 2024, 24(9): 090207 .

CHEN Yi, YUE Kun, LYU Fuqiang,YAO Daping. Advances in Heterogeneous Integration Packaging Technology of Integrated Circuits[J]. Electronics & Packaging, 2024, 24(9): 090207 .

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