中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装

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基于低温铜烧结技术的大功率碳化硅模块电热性能表征

闫海东1,蒙业惠2,刘昀粲2,刘朝辉3   

  1. 1. 浙江大学电气工程学院,杭州  310027;2. 桂林电子科技大学机电工程学院,广西 桂林  541214;3. 北京国家新能源汽车技术创新中心有限公司,北京  100176
  • 收稿日期:2024-11-07 修回日期:2025-01-13 出版日期:2025-01-20 发布日期:2025-01-20
  • 通讯作者: 闫海东
  • 基金资助:
    国家重点研发计划(2021YFB3602303)

Characterization of Electrothermal Properties of High-Power Silicon Carbide Modules Based on Low-Temperature Copper Sintering Technology

YAN Haidong1, MENG Yehui2, LIU Yuncan2, LIU Chaohui3   

  1. 1. College of Electrical Engineering, Zhejiang University, Hangzhou 310027, China; 2. School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guilin 541214, China; 3. Beijing National New Energy Vehicle Technology Innovation Center Co., Ltd., Beijing 100176, China
  • Received:2024-11-07 Revised:2025-01-13 Online:2025-01-20 Published:2025-01-20

摘要: SiC器件的比导通电阻仅有Si基器件的1/5,同时在高频、高温、高功率密度的车规级封装领域展现出更大优势,但SiC器件的高通流密度对其散热设计提出了更高要求。高导热率、低工艺温度、高服役温度的银烧结有助于优化功率模块的热管理,但鉴于烧结银过高的成本与电迁移问题,本文提出了一种针对SiC器件的全铜烧结互连方法,高质量铜互连层剪切强度超过130 MPa。与传统功率模块相比,全铜烧结功率模块的结壳热阻降低了6.12 K/kW(12.47%),动、静态测试结果表明模块具有良好的电学性能。

关键词: 功率模块封装, 铜烧结, 铜线键合

Abstract: The specific on-resistance of SiC devices is only 1/5 of Si-based devices. At the same time, it shows greater advantages in the field of high-frequency, high-temperature, and high-power density automotive-grade packaging. However, the high flow density of SiC devices makes its heat dissipation design difficult. Higher demands were made. Silver sintering with high thermal conductivity, low process temperature, and high service temperature can help optimize the thermal management of power modules. However, in view of the high cost and electro-migration problems of sintered silver, this article proposes an all-copper sintered interconnect for SiC devices. Connection method, high-quality copper interconnect layer shear strength exceeds 130 MPa. Compared with traditional power modules, the junction-case thermal resistance of the all-copper sintered power module is reduced by 6.12 K/kW (12.47%). The dynamic and static test results show that the module has good electrical performance.

Key words: power module packaging, copper sintering, copper wire bonding