MEMS器件辐射损伤机理与抗辐射加固技术研究进展*

doi:10.16257/j.cnki.1681-1070.2025.0176

摘要/Abstract

摘要： 随着MEMS技术在空间探测、核能工程等极端辐射环境中的广泛应用，其辐射可靠性问题日益凸显。系统分析了基于不同工作原理（静电驱动、压阻传感、压电转换等）的MEMS器件在辐射环境下的失效机理，重点总结了电离辐射、位移损伤等效应对器件性能的影响规律。详细评述了从材料优化、结构设计到工艺改进的抗辐射加固技术研究进展。最后，针对未来深空探测、核反应堆监测等应用需求，提出了MEMS抗辐射加固技术的发展趋势和研究方向，为高可靠MEMS器件的设计与应用提供参考。

关键词: MEMS, 极端辐射环境, 辐射损伤机理, 抗辐射加固技术, 可靠性设计

Abstract: With the widespread application of MEMS technology in extreme radiation environments such as space exploration and nuclear engineering, the issue of radiation reliability has become increasingly prominent. The failure mechanisms of MEMS devices based on different working principles (electrostatic actuation, piezoresistive sensing, piezoelectric conversion, etc.) under radiation environments are systematically analyzed, with particular focus on the effects of ionizing radiation and displacement damage on device performance. A comprehensive review is presented on recent advances in radiation-hardening technologies, encompassing material optimization, structural design, and process improvements. Furthermore, addressing future application requirements in deep-space exploration and nuclear reactor monitoring, the development trends and research directions for radiation-hardened MEMS are proposed, providing valuable insights for the design and application of highly reliable MEMS devices.

Key words: MEMS, extreme radiation environment, radiation damage mechanism, radiation-hardening technology, reliability design

中图分类号:

TN306

郭凯茜，朱志成，徐东航，聂萌. MEMS器件辐射损伤机理与抗辐射加固技术研究进展^*[J]. 电子与封装, 2025, 25(11): 110102 .

GUO Kaixi, ZHU Zhicheng, XU Donghang, NIE Meng. Advances in Radiation Damage Mechanisms and Radiation-Hardening Technologies for MEMS Devices[J]. Electronics & Packaging, 2025, 25(11): 110102 .

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中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

MEMS器件辐射损伤机理与抗辐射加固技术研究进展^*

Advances in Radiation Damage Mechanisms and Radiation-Hardening Technologies for MEMS Devices

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