碳化硅器件挑战现有封装技术
曹建武, 罗宁胜, Pierre Delatte, Etienne Vanzieleghem, Rupert Burbidge
SiC Device t oChallenge Existed Packaging Technologies
CAO Jianwu, LUO Ningsheng, DELATTE Pierre, VANZIELEGHEM Etienne, BURBIDGE Rupert
电子与封装
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2022, (2): 20102
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DOI: 10.16257/j.cnki.1681-1070.2022.0202
