半导体封装Cu-Cu互连接头烧结性能研究
吴松, 张昱, 曹萍, 杨冠南, 黄光汉, 崔成强
Study on Sintering Properties of Cu-Cu InterconnectJoint for Semiconductor Package
WU Song, ZHANG Yu, CAO Ping, YANG Guannan, HUANG Guanghan, CUI Chengqiang
电子与封装
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2023, (3): 30110
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DOI: 10.16257/j.cnki.1681-1070.2023.0068
