基于硅基扇出（eSiFO®）技术的先进指纹传感器晶圆级封装工艺开发
申九林, 马书英, 郑凤霞, 王姣, 魏浩
Development of Wafer Level Packaging Process of Advanced Fingerprint Sensors Based on Embedded Silicon Fan-Out (eSiFO®) Technology
SHEN Jiulin, MA Shuying, ZHENG Fengxia, WANG Jiao, WEI Hao
电子与封装
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2023, (3): 30111
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DOI: 10.16257/j.cnki.1681-1070.2023.0074
