中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

导航
接触式、双界面式智能卡机械强度测试失效及改善措施
吴彩峰;王修垒;仝飞
Mechanical Strength Test Failure and Improvement Measures of Contact and Dual-Interface Smart Cards
WU Caifeng, WANG Xiulei, TONG Fei
电子与封装 . 2024, (1): 10203 .  DOI: 10.16257/j.cnki.1681-1070.2024.0008