大尺寸有机基板的材料设计与封装翘曲控制
李志光,胡曾铭,张江陵,范国威,唐军旗,刘潜发,王珂
Material Design and Package Warpage Control for Large-Size Organic Substrates
LI Zhiguang, HU Zengming, ZHANG Jiangling, FAN Guowei, TANG Junqi, LIU Qianfa, WANG Ke
电子与封装
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2024, (2): 20106
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DOI: 10.16257/j.cnki.1681-1070.2024.0039
