中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

导航
基于有机基板的化学镍钯浸金工艺应用与测评
刘彬灿,李轶楠
Application and Evaluation of Chemical Nickel-Palladium Immersion Gold Process Based on Organic Substrates
LIU Bincan, LI Yi’nan
电子与封装 . 2024, (2): 20110 .  DOI: 10.16257/j.cnki.1681-1070.2024.0084