集成电路有机基板倒装焊失效分析与改善

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朱国灵,韩星,徐小明,季振凯

Failure Analysis and Improvement of Flip Chip of Organic Substrate for Integrated Circuit

ZHU Guoling, HAN Xing, XU Xiaoming, JI Zhenkai

电子与封装 . 2024, (2): 20111 . DOI: 10.16257/j.cnki.1681-1070.2024.0077