基于Anand模型的BGA封装热冲击循环分析及焊点疲劳寿命预测*
张惟斌,申坤,姚颂禹,江启峰
Thermal Impact Cycle Analysis and Solder Joint Fatigue Life Prediction of BGA Package Based on Anand Model
ZHANG Weibin, SHEN Kun, YAO Songyu, JIANG Qifeng
电子与封装
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2024, (3): 30207
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DOI: 10.16257/j.cnki.1681-1070.2024.0030
