LTCC基板微通道进出口布局结构散热性能仿真分析<sup>*</sup>

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廖志平,罗冬华

Simulation Analysis of Heat Dissipation Performance of Microchannel Inlet and Outlet Layout Structure for LTCC Substrate

LIAO Zhiping, LUO Donghua

电子与封装 . 2024, (3): 30208 . DOI: 10.16257/j.cnki.1681-1070.2024.0048