中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

导航
ABF塑封基板叠孔的高可靠结构设计
葛一铭,谢爽,吕晓瑞,刘建松,孔令松
Highly Reliable Structural Design of Stacked Holes for ABF Plastic Package Substrates
GE Yiming, XIE Shuang, LYU Xiaorui, LIU Jiansong, KONG Lingsong
电子与封装 . 2024, (3): 30209 .  DOI: 10.16257/j.cnki.1681-1070.2024.0066