高功率半导体用纳米银焊膏的研究现状*
张宸赫,李盼桢,董浩楠,陈柏杉,黄哲,唐思危,马运柱,刘文胜
Research Status of Nano Silver Solder Paste for High-Power Semiconductors
ZHANG Chenhe, LI Panzhen, DONG Haonan, CHEN Baishan, HUANG Zhe, TANG Siwei, MA Yunzhu, LIU Wensheng
电子与封装
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2024, (5): 50203
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DOI: 10.16257/j.cnki.1681-1070.2024.0059
