兼具高导热、低膨胀系数的超低介电损耗封装材料

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徐杰

Ultralow Dielectric Loss Packaging Material with High Thermal Conductivity and Low Coefficient of Thermal Expansion

电子与封装 . 2024, (5): 50601 . DOI: 10.16257/j.cnki.1681-1070.2024.0116