镀银板表面粗糙度对纳米银焊膏快速烧结互连质量的影响
李志豪,汪松英,洪少健,孙啸寒,曾世堂,杜昆
Effect of Surface Roughness of Silver-Plated Plates on the Quality of Rapidly Sintered Interconnections with Nano Silver Solder Paste
LI Zhihao, WANG Songying, HONG Shaojian, SUN Xiaohan, ZENG Shitang, DU Kun
电子与封装
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2024, (7): 70201
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DOI: 10.16257/j.cnki.1681-1070.2024.0076
