硅通孔3D互连热-力可靠性的研究与展望<sup>*</sup>

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Research and Prospect on Thermal-Mechanical Reliability of Through Silicon Via 3D Interconnection

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电子与封装 . 2024, (6): 60103 . DOI: 10.16257/j.cnki.1681-1070.2024.0104