TSV电镀过程中Cu生长机理的数值模拟研究进展<sup>*</sup>

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许增光, 李哲, 钟诚, 刘志权

Progress of Numerical Simulation of Cu Growth Mechanism During Electroplating of TSV

XU Zengguang, LI Zhe, ZHONG Cheng, LIU Zhiquan

电子与封装 . 2024, (6): 60104 . DOI: 10.16257/j.cnki.1681-1070.2024.0109