硅转接板制造与集成技术综述

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徐成,樊嘉祺,张宏伟,王华,陈天放,刘丰满

Review of Silicon Interposer Fabrication and Integration Technology

XU Cheng, FAN Jiaqi, ZHANG Hongwei, WANG Hua, CHEN Tianfang, LIU Fengman

电子与封装 . 2024, (6): 60106 . DOI: 10.16257/j.cnki.1681-1070.2024.0119