三维集成电路先进封装中聚合物基材料的研究进展*
范泽域, 王方成, 刘强, 黄明起, 叶振文, 张国平, 孙蓉
Research Progress of Polymer-Based Materials for Advanced Packaging of 3D Integrated Circuits
FAN Zeyu, WANG Fangcheng, LIU Qiang, HUANG Mingqi, YE Zhenwen, ZHANG Guoping, SUN Rong
电子与封装
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2024, (6): 60107
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DOI: 10.16257/j.cnki.1681-1070.2024.0149
