硅通孔三维互连与集成技术
马书英, 付东之, 刘轶, 仲晓羽, 赵艳娇, 陈富军, 段光雄, 边智芸
Three Dimensional Interconnection and Integration Technology of TSV
MA Shuying, FU Dongzhi, LIU Yi, ZHONG Xiaoyu, ZHAO Yanjiao, CHEN Fujun, DUAN Guangxiong, BIAN Zhiyun
电子与封装
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2024, (6): 60109
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DOI: 10.16257/j.cnki.1681-1070.2024.0136
