集成电路互连微纳米尺度硅通孔技术进展*
黎科,张鑫硕,夏启飞,钟毅,于大全
Advances in Micro- and Nano-Scale Through-Silicon-Via Technology for Integrated Circuits Interconnecting
LI Ke, ZHANG Xinshuo, XIA Qifei, ZHONG Yi, YU Daquan
电子与封装
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2024, (6): 60111
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DOI: 10.16257/j.cnki.1681-1070.2024.0144
